Winsmart Electronic Co., Ltd.  

Product Name: FPC Solder to PCB Hot Bar Bonding Machine Model NO.: FS-S22 Type: Pulse Heat Electric Current: Pulse Shielding Gas: Air Style: Vertical Control: Semi-Automatic Cooling Way: Air Cooling Trademark: Winsmart Transport Package: Plywood Case Specification: fpc to pcb Origin: China HS Code: 8515809090 Product Description FPC Solder to PCB Hot Bar Bonding MachineFPC Solder to PCB Hot Bar Bonding Machine Features:1.Extremely short cycle time with rotary table design2.Product loading and unloading can be done during the heat sealing process3.High quality heat seal application up to 0.25mm pitch4.Pneumatic bonding head provide up to 3,900N force5.Digital programmable pressure control with LCD display6.Closed loop PID temperature control with visible LED display7.Bonding cycle is triggered by a real time pressure sensor8.Floating Thermode ensure consistent pressure and heat transfer along the flexfoil to LCD and/or PCB9.Precision product fixtures (2X), easy exchange, provided with micrometer alignment and vacuum to fix components10.Optional CCD alignment module with frame, camera, lens, monitor and illumination for fine pitch application11.Full microprocessor logic control.FPC Solder to PCB Hot Bar Bonding Machine Specification:ModelFS-S22Size500mm X 750mm X 910mmWork Air Pressure0.5-0.7MPAWorking Area110mm X 150mmTemperature setup0-400ºCTolerance of Temp+2ºCTime of pressing0-99sTolerance of Pressing0.05MPAHot Bar Bonding Machine Application: